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Implementation Solution Service
Well, we provide turnkey solutions from the development of flip chip implementation methods using TEG chips as our core business to the prototyping of implementations using various methods, including bumping for flip chips, re-wiring processing, and 3D implementation wafer MEMS processing (cavity and through-via processing).
Wide-ranging support for cooling structure design, thermal fluid simulation, and evaluation environment setup!
We provide implementation solution services. With the technology and know-how cultivated from developing high-performance to mobile consumer-grade devices, we solve our customers' development challenges. Please feel free to contact us if you have any requests. 【Product Line】 ■ Design ■ Prototyping ■ Simulation ■ Evaluation *For more details, please download the PDF or feel free to contact us.
